Is the ESP32-C3-Mini-1 glued to the DevKit?

[sircastor]

I have been trying to solve an issue with my custom PCBs when trying to program an ESP32-C3-Mini. I wanted to see if I could program the device on one of the DevKitM-1 boards that I have, so I used a hot air rework station to reflow the solder to remove the onboard ESP32-C3-Mini. Regardless of the temperature I used, I could not get the module off of the board.

Is the module glued to the board? Can it be removed and replaced?

[ESP_Sprite]

Not to my knowledge, but the C3-Mini-1 does have a large ground pad that is directly under the module and thermally has the mass of an entire ground plane to dissipate heat, and that ground pad is soldered to the ground plane of the devkit, increasing the thermal mass even more. To get it loose, you may need to heat the bottom of the devkit as well.